Dr. Yuanwei Bin's Website
Director of AI Software Department, Tenfong Technology
ybin@eitech.edu.cn
Ningbo & Shenzhen, China
I am Yuanwei Bin, a fluid dynamicist developing data-enabled tools for high-fidelity industrial simulation. I lead the AI Software Department at Tenfong Technology in Shenzhen while serving as a Research Assistant Professor at the Eastern Institute of Technology, Ningbo. My work focuses on accelerating aerodynamic analysis and turbulence modeling with machine learning so that engineers can iterate designs in seconds instead of hours.
Professional Appointments
- 2025–present: Director of AI Software Department, Tenfong Technology Co., Ltd., Shenzhen, China.
- 2024–present: Research Assistant Professor, College of Engineering, Eastern Institute of Technology, Ningbo, China.
- 2021–2023: Visiting Scholar, Flow Physics and Computational Research Lab (PI: Xiang I. A. Yang), The Pennsylvania State University, USA.
Education
- 2019–2024: Ph.D. in Mechanics, Peking University, Beijing, China (advisor: Yipeng Shi).
- 2015–2019: B.Eng. in Energy Engineering, University of Science and Technology of China, Hefei, China.
- 2015–2019: Double major in Computer Science, University of Science and Technology of China, Hefei, China.
- 2017: Exchange student, National Tsing Hua University, Hsinchu, Taiwan.
Notable Awards and Scholarships
- 2024: Winner (1/323), Rapid Aerodynamic Drag Prediction for Arbitrary 3D Vehicle Competition, IJCAI 2024.
- 2023: CFD Best Paper Award, ASME IMECE 2023.
- 2023: Peking University President’s Scholarship.
- 2021: Peking University President’s Scholarship.
- 2021: Outstanding Graduate, University of Science and Technology of China.
Publications
I publish on data-enabled turbulence modeling, reduced-complexity solvers, and industrial CFD workflows. Please see the publications page or my Google Scholar profile for the full list.
Technical and Personal Skills
- Programming languages: C, C++, Python, Fortran, Matlab.
- Industry software: OpenFOAM, PointWise, SolidWorks, AutoCAD, and related CAE toolchains.